ALUMINUM NITRIDE, HI-TEMP, THERMALLY CONDUCTIVE ADHESIVE

Description

Ceramabond tm 865, a new high temperature, aluminum nitride filled, ceramic adhesive developed by Aremco Products, Inc., is now used for bonding ceramics, metals and semiconductor materials for applications in which high temperature resistance and high thermal conductivity are required. FEATURES Ceramabond tm 865 is a single part, aluminum nitride filled, silicate-bonded ceramic adhesive system for use in applications to 3000 °F (1650 °C). Highly filled with aluminum nitride particles less than 10 microns, Ceramabond tm 865 provides exceptional thermal conductivity of 60-80 W/m-°K and a dielectric strength better than 500 volts/mil. Ceramabond tm 865 is a water-dispersed system that contains no volatile organic compounds. It is easy-to-apply and cleans up with warm water and soap in the uncured state. Curing is accomplished easily by heating at 200 oF for 2-4 hours. Further curing and strengthening is achieved in-situ as the operating temperature rises above 500 oF. Applications for Ceramabond tm 865 include the bonding of high thermal conductivity ceramics such as aluminum nitride, aluminum oxide and boron nitride. It can also be used to bond a variety of metals and semiconductor materials for applications in which high temperature resistance and high thermal conductivity and dielectric strength are required.

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