Automated Circuit Board Optical Inspection System

Description

YESTech, a leading supplier of automated optical and x-ray inspection systems for the electronics industry, introduces its new B3 benchtop automated optical inspection system for populated printed circuit boards. The B3 offers up to a 3x improvement in inspection speed, new Fusion Lighting(TM) and advanced image processing technology to provide the highest defect coverage available of any benchtop system. The B3 also features enhanced board handling in a new sleek eye-catching package and complete software/board setup compatibility with the other YESTech AOI systems. Programming the B3 is fast and intuitive. Operators typically take less than 30 minutes to create a complete inspection program including solder joints. The B3 utilizes a standard package library to simplify training and ensure program portability across manufacturing lines. The newly available image processing technology integrates several techniques, including color, normalized correlation and rule-based algorithms to provide complete inspection coverage with extremely low false failure rates. "The new YTV B3 Benchtop AOI offers faster throughput, improved board handling, and other enhancements to further increase the YESTech advantage in cost / performance and customer ROI,” said Troy Johnson, YESTech's VP of Sales. "The B3 is equally effective for pre / post-reflow inspection. Remote programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield enhancement solution”, concluded Johnson. About YESTech Headquartered in San Clemente, California, YESTech is a leading provider of automated optical and high-resolution x-ray inspection systems, with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor-packaging industries.
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