Bonded Abrasive Grinding and Cut-Off Wheels

Description

3M Abrasive Systems introduces 3M Cubitron II Bonded Abrasive Grinding and Cut-Off Wheels, a revolutionary new technology that reinvents the grinding process. With Cubitron II abrasives, users get precision-shaped grain technology that cuts faster, stays sharper longer, and requires less pressure than conventional grinding and cut-off wheels. In addition, the abrasives can help reduce operator fatigue and increase productivity. 

Conventional ceramic abrasive grains are irregular in shape, and work by “plowing” through metal, which can cause heat buildup, slower cutting and shorter life. But the precision-shaped grains in Cubitron II grinding wheels continuously fracture to form sharp points and edges. This technology helps Cubitron II abrasives slice cleaner and faster, stay cooler, and last longer than conventional wheels. 

Cubitron II abrasives offer performance that dramatically surpasses that of traditional grinding wheels made with aluminum oxide, alumina zirconia or ceramic grain. In fact, competitive products require up to three times the amount of pressure to match the cut of Cubitron II abrasives. 

Specs

  • cuts faster, stays sharper longer
  • requires less pressure


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