High Temperature Ceramic Adhesive

Description

Ceramabond 569 is a single part, ceramic-filled paste that bonds tenaciously to ceramic, metal and quartz substrates. This compound is rated for operating temperatures to 3000 °F (1650 °C) and exhibits a dielectric strength of 200 volts per mil, volume resistivity of 109 ohm-cm, coefficient of thermal expansion of4.2 in/in/°F, and torque strength of 6.0 ft-lbs. Ceramabond 569 is applied easily using a brush, syringe or automatic dispensing equipment.

Once applied,curing is accomplished by heating at 200 oF for 2 hours or drying at room temperature for 24 hours. Curedproduct exhibits minimal shrinkage and offers exceptional mechanical strength, and moisture and thermalshock resistance.Primary applications for Ceramabondtm 569 include the assembly of platinum resistance heaters, igniters,thermocouples, probes and sensors such as oxygen analyzers, gas chromatographs, mass spectrometers, andhigh vacuum components. Ceramabond 569 is available from stock in pint, quart, gallon and five-gallon pails.

Specs

  • torque strength of 6.0 ft-lbs
  • bonds tenaciously to ceramic, metal and quartz substrates
  • volume resistivity of 109 ohm-cm
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