IMTS 2016: Renishaw Introduces New Non-Contact Vision Probe

Description

RVP, Renishaw's new vision measurement probe for use with the REVO 5-axis measurement system on co-ordinate measuring machines (CMMs), increases the multi-sensor capability of REVO by adding non-contact inspection to the exisiting touch-trigger, high-speed tactile scanning and surface finish measurement capability of the system. The RVP probe will be demonstrated at IMTS at booth E-5509.

For certain applications, non-contact inspection provides clear advantages over traditional tactile probing techniques. Thin sheet metal parts or components with large numbers of holes as small as 0.5 mm, and parts which are not suited to tactile measurement, can be fully inspected with the RVP system. RVP also gives exceptional improvements in throughput and CMM capability by utilizing the 5-axis motion and infinite positioning provided by the REVO head.

The RVP system consists of a probe and a range of modules that are automatically interchangable with all other probe options available for REVO. Data from multiple sensors is automatically referenced to a common datum. This flexibility means that the optimum tool can be selected to inspect a wide range of features, all on one CMM platform.

When using RVP, part illumination is provided by integrated programmable LED lighting inside each module. Background feature enhancement is also available using backlighting combined with custom part fixturing.

The RVP system is managed by the same I++ DME compliant interface as REVO and full user functionality is provided by Renishaw's MODUSTM metrology software. New MODUS vision software capability includes RVP configuration, image processing with application specific options and automatic image storage for review and further analysis.


Specs

Booth E-5509

Benefits

  • Added part inspection capability
  • Small features and delicate or flexible parts that cannot be
  • measured using tactile probes can now be inspected on a 5-axis non-contact measurement platform.
  • Added value multi-sensor system
  • High speed data collection
  • 5-axis motion between part features and real time image
  • processing dramatically increase data collection rates.
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