Low Viscosity Epoxy Potting Compound

Description

Epoxies, Etc… has developed a new low viscosity epoxy potting and encapsulating compound. The 20-3060 Epoxy was designed for electronic potting applications that require a low viscosity material to flow quickly in and around electronic components. The 20-3060 is an electronic grade epoxy resin system. It will provide electrical insulation, chemical resistance and protection from the environment. We believe 20-3060 will have high reader interest due to the following unique combination of properties: • 20-3060 quickly self levels • 20-3060 efficiently releases air bubbles • 20-3060 provides a smooth glasslike finish • 20-3060 provides outstanding environmental protection 20-3060 is available in quarts, gallons and five gallon pails.

Specs

• Color - Black • Mix Viscosity @ 25oC cps - 10,000 • Pot Life, 200 gram mass @ 25oC - 1.30 HRS. • Specific Gravity, 25oC, Resin - 1.50 • Hardness, Shore D - 82 • Linear Shrinkage, % - .50 • Tensile Strength, psi - 10,000 • Compressive Strength, psi - 22,500 • Operating Temp. Range,oC - -50 to +135 • Dielectric Strength, Volts/Mil - 460 • Dielectric Constant at 100 HZ - 4.51 • Volume Resistivity, OHM-CM - 3.99 x 10 14 • Dissipation Factor, 100 HZ - .01
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