low viscosity two component epoxy adhesive, sealant and encapsulant


Master Bond Polymer Adhesive EP21AOLV is a low viscosity two component epoxy adhesive, sealant and encapsulant formulated to cure at room temperature or more rapidly at elevated temperatures, with a one- to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 3000 psi at room temperature which unlike that of many other epoxy adhesives, is relatively insensitive to mixing ratio or substrate cleaning procedures. It produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solvents) over the exceptionally wide temperature range of -60°F up to more than 250°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. EP21AOLV has good flowability and can be used as a potting compound where medium and large size castings are required. The hardened adhesive exhibits high thermal conductivity and is an electrical insulator. The thermal expansion coefficient is remarkably low. Color of part A gray, part B amber. Master Bond EP21AOLV adhesive is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.

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