EP33 Two-Component, Room Temperature Curing Epoxy
Description
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two-component epoxy adhesive for high-temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high-strength bonds whose strength is maintained even after long exposures to temperatures in the 400-450°F range. Master Bond Polymer Adhesive EP33 is available in a non-drip version called EP33ND which can be applied without sagging or dripping even on vertical surfaces. It Is 100% reactive and does not contain any diluents or solvents.
Specs
- Suitable for bonding, sealing and coating
- Easy machinability
- High dimensional stability
- Serviceable up to +450°F
- Meets MIL-STD-883J Section 3.5.2 for thermal stability
- Withstands 1,000 hours 85°C/85% RH