MASTER BOND POLYMER ADHESIVE SUPREME 33

Description

Master Bond Polymer System Supreme 33 is a unique, room temperature curing, toughened epoxy adhesive/sealant, offering exceptionally high temperature resistance. This innovative system offers high bond strength, shear and peel, along with excellent sealing properties for service from -80°F to +425° F. It has a convenient mix ratio of 100:70 by weight or 1:1 by volume along with a moderate working life. This toughened system has superior impact, thermal shock and resistance to thermal cycling. It is 100% reactive and contains no solvents or diluents. A non-drip version called Supreme 33ND is also available.

Specs

- Convenient mixing: non-critical mix ratio (100:70) by weight or 1:1 by volume

- Easy application: contact pressure only required for cure: adhesive spreads evenly and smoothly

- Versatile cure schedules: ambient temperature cure or fast elevated temperature cures as required

- High bonding strength to similar and dissimilar substrates from -80°F to +425°F

- Superior durability, dimensional stability, thermal shock and chemical resistance

- Excellent thermal cycling capabilities

- Superior retention of strength at high temperature

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