New One Part Epoxy Features Low Viscosity and Rapid Cure


Master Bond EP3RRLV is a new one component, tough epoxy system introduced by Master Bond Inc., Hackensack, N.J. It is designed for potting, encapsulation and underfill applications. EP3RRLV will cure in 30-35 minutes at 220°F and 10-15 minutes at 300°F. It has superior electrical insulation properties. This unique formulation offers high physical strength properties, remarkable thermal shock and heat resistance and excellent protection against water and chemicals. It has a service operating temperature range of -80°F to +300°F.

Master Bond EP3RRLV requires no mixing and has an unlimited working life at room temperature. It bonds well to metals, ceramics, glass and most plastics. It is 100% reactive and does not contain any solvents or volatiles. As a toughened system, it is able to withstand severe thermal and mechanical stresses without impairment of performance characteristics. EP3RRLV has excellent flowability and can be cast in thicknesses beyond 1 inch. The combination of rapid curing, convenient handling, and flowability makes EP3RRLV a highly effective underfill epoxy.

Master Bond EP3RRLV has a tensile strength of >5,000 psi and a Shore D hardness of 80-85. It has a viscosity of 1,000 - 1,500 cps and is a light yellow color. Other colors are available upon request. Particularly noteworthy is its outstanding dimensional stability.

EP3RRLV is available for use in pint, quart, gallon and 5 gallon pail containers. For ease of application it can be obtained in syringe applicators.

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