Optical Profiler for Metrology of PCB Packaging Apps

Description

APM650 system employs Coherence Scanning Interferometry (CSI) measurement technology that enables manufacturers to quantify critical feature parameters on PCB panels up to 650 x 650mm.

It has the ability to measure a wide range of surfaces from rough to super smooth, including thin films, steep slopes, high aspect ratios and large steps. An extensive range of Zygo parfocal objectives can be used with APM650 profilers from 1.4x to 100x, along with a wide selection of application specific objectives that include glass compensated lenses for measuring through a transmissive packaging window.

Typical applications for the APM650 profiler include depth, size, and critical dimension metrology of via holes, solder resist openings, traces, trenches and bumps.

Specs

  • quantify critical feature parameters on PCB panels up to 650 x 650mm
  • wide selection of application specific objectives that include glass compensated lenses for measuring through a transmissive packaging window
  • employs Coherence Scanning Interferometry (CSI) measurement technology
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