Sapphire Wafer Carriers

Description

Meller Sapphire Wafer Carriers feature Moh 9 hardness, which is second only to diamond, allowing them to be produced as thin as 0.018 in. with 1.2 micron uniform thickness and 10 arc-sec. parallelism.  Custom perforated with hole patterns to fit vacuum hold-down or de-lamination fixtures, they facilitate semiconductor thinning to assure consistent part-to-part uniformity.

Ideally suited for thinning GaAs and other semiconductor materials, Meller Sapphire Wafer Carriers are available in 2 to 6-in dia. sizes and can be supplied with reference flats and laser markings.  Capable of withstanding repeated use, these sapphire wafer carriers are hard, strong, chip- and scratch-resistant, and are impervious to solvents and etchants.

Specs

  • Hardness: Moh 9

  • Thickness: ≥0.018 in.

  • Diameter: 2 to 6 in.
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