SiC Abrasive Papers Increase Remove Rate by Up to 20 Percent
Description
Buehler’s new CarbiMet? 2 silicon carbide (SiC) abrasive papers increase material removal rates up to 20 percent and 10 percent compared to original CarbiMet and competitive grinding papers, respectively. Increased material removal rates reduce total procedure time. On average, CarbiMet 2 removes 75 percent of all material within the first 60 seconds of use.
CarbiMet 2 exhibits minimal material deformation, provides a consistent scratch pattern and features a water-resistance premium C weight paper with exceptional life-to-material-removal ratio. Although SiC papers have an effective grinding life of two to three minutes, CarbiMet 2 can maintain its paper integrity for up to 100 minutes in durability tests conducted at Buehler’s materials analysis lab. Manufactured in an ISO 14001/2004 certified facility, CarbiMet 2 is produced with less pollution, in part due to an efficient water and air recycling system and an environmentally friendly resin bond.
Applications include dry and wet grinding and polishing of ferrous and non-ferrous materials, including stainless steel, titanium, copper, aluminum and printed wired boards in automotive, aerospace, primary metals, metal fabrication, welding, testing and quality control environments.
CarbiMet 2 exhibits minimal material deformation, provides a consistent scratch pattern and features a water-resistance premium C weight paper with exceptional life-to-material-removal ratio. Although SiC papers have an effective grinding life of two to three minutes, CarbiMet 2 can maintain its paper integrity for up to 100 minutes in durability tests conducted at Buehler’s materials analysis lab. Manufactured in an ISO 14001/2004 certified facility, CarbiMet 2 is produced with less pollution, in part due to an efficient water and air recycling system and an environmentally friendly resin bond.
Applications include dry and wet grinding and polishing of ferrous and non-ferrous materials, including stainless steel, titanium, copper, aluminum and printed wired boards in automotive, aerospace, primary metals, metal fabrication, welding, testing and quality control environments.