Structural Adhesive Cures at Room Temperature
Formulated for structural applications in extreme environments with temperatures from -80°F to +425°F, Master Bond Supreme 33 has superior resistance to thermal cycling, thermal shock and impact. This toughened, two-component epoxy offers high structural bond strength to a wide variety of substrates including metals, glass, ceramics, wood, vulcanized rubbers and many plastics. Supreme 33 also resists chemicals including water, oil and many organic solvents.
Supreme 33 has a mix ratio of 100 to 70 by weight or 1 to 1 by volume. It cures conveniently at room temperature in 48 to 72 hours. For optimal performance, the suggested schedule is curing overnight at room temperature followed by 2 to 3 hours at 150 to 200°F. This 100% reactive epoxy does not contain any solvents or diluents, has exceptional dimensional stability and features very low shrinkage upon cure.
It produces high performance bonds boasting a shear strength over 2,500 psi, a tensile shear strength greater than 7,500 psi and a T-peel strength exceeding 15 pli. With a volume resistivity of 1014 ohm-cm, a dielectric strength over 400 volts/mil, and a dielectric constant of 3.8 at 75°F, Supreme 33 is an outstanding electrical insulator that is widely used in the electronic, electrical, aerospace and OEM industries. Supreme 33 is also available in a non-drip version called Supreme 33ND.
Master Bond Toughened Adhesives
Master Bond Supreme 33 combines exceptional durability and toughness for high temperature resistance bonding and sealing applications.
- superior resistance to thermal cycling, thermal shock and impact
- toughened, two-component epoxy
- does not contain any solvents or diluents