Thermal Interface Material
While COOL-PAD™ has some intrinsic tack strength, it is not designed for bonding. A mechanical fastener must be used to provide assembly integrity. A mechanical fastener of 5 psi or more is recommended to provide intimate contact between the COOL-PAD™ and the interfacing surface. Because COOL-PAD™ is compressible, it will fill in uneven height differentials and warps between the mating surfaces. The ultimate performance of COOL-PAD™ is achieved after the first cycle of melt-flow phase-change at 45°C or automatically when the device heats up during operation or with externally applied heat if the device is not anticipated to reach 45°C . COOL-PAD™ CPR7154 is designed for thermal interface applications to withstand the worst of temperature and moisture exposure in outdoor LED luminaire applications with modules from Philips, Cree, Bridgelux, etc. Of course, the same phase-change pad works great for CPU and GPU in Xbox360, Play Station, and other game consoles.
COOL-PAD™ CPR7154 is also ideal for CPU modules and graphic card interfaces in laptops and desktops such as Asus, Samsung, BenQ, Foxconn and other OEM.