COOLSPAN TECA Film
Description
COOLSPAN Thermally & Electrically Conductive Adhesive (TECA) Film provides reliable high-temperature performance. The film is a thermosetting, epoxy-based, silver-filled adhesive film used to bond circuit boards to heavy metal backplanes, heat sink coins, and RF module housings. The adhesive can be used as an alternative to fusion bonding, sweat soldering, mechanical or press-fit metal attachment.
This film provides both a thermally and electrically conductive bond interface. COOLSPAN TECA Film is supplied in sheet form on a PET carrier and is easy to handle when converting into preforms and when peeling from the carrier. It is able to survive lead-free solder processing and offers outstanding chemical resistance and high-temperature performance, helping you to keep things cool. COOLSPAN TECA Film has been demonstrated to easily survive 5X lead-free solder exposures, 1,000 hours at 85°C/85%RH, and 190°C for 10 days.
Specs
- Supplied on PET carrier
- High bond strength and reliability
- Thermally robust
- Chemically resistant
- Easily converted into pre-forms and easily handled
- Keeps conductive materials out of stay-out zones
- Accommodates post attachment processing
- Provides electrical continuity and heat dissipation to heat sinks
- Low flow during pressure cure