Universal Contact Provides Extended Life Cycles In Portable Electronics Applications


ITT Interconnect Solutions, a
leading global manufacturer and supplier of connectors, interconnects,
and cable assemblies, has developed a small form factor, stamped
contact known as the Universal Contact. The contact is ideal for
solderless component interconnection where miniaturization,
reliability and flexibility are required. A unique pre-loading and
anti-lift design maximizes contact force to ensure consistent and
reliable contact integrity, while the contact's X-Y-Z movement ability
provides a robust connection between the contact and
component assembly.

"The Universal Contact was developed in response to customer
requests to address the problem of uneven spring forces and poor
contact resistance of connectors in mobile phone components," said
Keith Teichmann, director of marketing for ITT Interconnect
Solutions. "Miniaturization of the end product and reliable, robust
interconnects continue to play a large role in portable devices, and
the design of the Universal Contact allows it to meet those needs."

The Universal Contact features an extended life cycle of 3000
operations, making it suitable for a variety of applications including
handset and wireless handheld devices, PC card products, home
electronic devices, medical products and automotive telematic systems.

Compliant with WEEE and RoHS directives, the Universal Contact is
available in contact heights ranging from 1.3mm to 4.0mm free
height. Compressed heights as low as 0.9mm are also available.
"Side wings" protect the active parts of the contact and prevent the
contact from overstressing, while dome contact points provide good
hertz stress and low contact resistance. The Universal Contact aids
designers by allowing freedom of board positioning and providing
minimized qualification time and a standard interface across
applications and platforms.
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