X1 Automated X-Ray Inspection System

Description

YESTech, an innovative provider of yield enhancement solutions for the electronics industry, announced today the introduction of its X1 automated x-ray inspection (AXI) system. This versatile system offers electronic manufacturers and semiconductor packagers advanced inspection capability of solder joints and critical hidden features. The x-ray images of solder joints are automatically analyzed to detect structural defects such as insufficient solder, voiding, shorts, and opens that typically account for up to 90% of the total defects on a complicated board. Programming of the X1 is fast and intuitive, with a typical complete inspection program being created by operators in less than 30 minutes. By utilizing a standard package library to simplify training and insure program portability across varied manufacturing lines, the X1 offers high defect detection, fast throughput and ultra low false calls. YESTech's remote programming maximizes system utilization and the real-time SPC software that is provided with the system provides a valuable yield enhancement solution. Don Miller, YESTech President, states, "For electronics manufacturers, Automated X-ray Inspection (AXI) is becoming increasingly popular because, like its counterpart, Automated Optical Inspection (AOI), AXI offers a cost effective, non-invasive inspection solution for today's complicated assemblies. The YESTech X1 now brings this important capability to market with the fastest return on investment available."
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