Benchtop Plating Measurement System


Bowman’s G Series XRF is a robust system that’s ideally suited for the analysis of precious metals – also tin or nickel - on printed circuit boards, wafers, connectors, and other electronic components. 


Its two most distinctive features are “bottom-up” measurement using a motorized Z-axis with laser-based autofocus, and precision video imaging. An available manual XY stage with 1.5 X 1.5”  travel facilitates easy positioning of small and large parts.    


The standard G Series configuration includes a single fixed collimator, solid-state PIN detector, and long-life micro-focus x-ray tube. As with all Bowman models, the components can be upgraded to include multiple collimators, a variable focal camera, or an SDD detector.


Like others in the Bowman XRF portfolio, G Series instruments simultaneously measure up to 5 coating layers, 10 elements in each layer; up to 25 elements in all.  Element range is Al (13) through U (92.)


To quantify coating thickness from the detected photons, G Series systems run advanced Xralizer software. Xralizer combines intuitive controls with time-saving shortcuts, extensive search capability, and "one-click" reporting.  The software also allows easy creation of new applications by the user.  Equally important: G Series XRFs are full-access instruments from the day of install: there are no dongles or lock-outs to complicate, delay, or add cost.


Bowman’s G Series desktop XRF is ideal for quality labs and production environments. It is highly advantageous for users with limited benchtop space - or budget limitations.  G Series XRFs are ideal for both plating thickness and solution analysis. 

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