Dale PHPA Series of Thin Film Wraparound Chip Resistors

Dale PHPA Series of Thin Film Wraparound Chip Resistors incorporate the self-passivated tantalum nitride film to provide increased moisture resistance as well as improved ESD, voltage coefficient, and resistance stability performance. These features allow for high thermal stability within harsh or hazardous environmental conditions.

The AEC-Q200 qualified, high-power thin film resistor series combines power ratings of 1.0W and 2.5W in the 1206 and 2512 case sizes, respectively. They significantly reduce board space and component counts by replacing larger or paralleled resistors. The PHPA resistors are designed with enlarged backside terminations to reduce the thermal resistance between the topside resistor layer and the solder joint on the end user’s circuit board.

Most thin film chip resistors have a low power capability. Therefore several chips must be used to accommodate higher power applications. In hazardous or unstable environmental conditions, resistors need to be fabricated with resistive materials that can handle the elements. The thin film series is fabricated with tantalum nitride (Ta2N). This offers superior moisture resistance and high thermal stability in harsh conditions.

The 1206 case size offers a resistance range of 12 to 30.1 Ω while the 2512 supplies a range of 10 to 30.1 Ω. The resistors have an ESD rating 5A (HBM) a resistor tolerance to ± 0.1% and TCR to ±25 ppm/°C. These qualities present new product design advantages such as reduced component count, increased design flexibility with higher power capability, reduced assembly costs, and improved board-level reliability.