EP3HTS-TC NASA Low Outgassing Silver Filled Epoxy


The EP3HTS-TC NASA Low Outgassing Silver Filled Epoxy is a one-part epoxy with thermal conductivity of 16-17 W/(m·K). It cures at temperatures of around 250 to 300°F (125 to 150°C) and has an unlimited working life at room temperature. The material features a thixotropic paste consistency and is not pre-mixed and frozen. It is well suited for automatic dispensing equipment or manual syringes and can be applied without any tailing. Primarily, it is formulated for use as a die attach and special purpose bonding material.


EP3HTS-TC is highly electrically conductive, with a volume resistivity of less than 1x10-6 ohm-cm.


The system exhibits good dimensional stability, resists thermal cycling, and has a low coefficient of thermal expansion. It has a glass transition temperature of 136°F (58°C) and is serviceable over the temperature range of -80 to +400°F (-62 to +204°C). This compound adheres well to a variety of substrates such as metals, composites, glass, ceramics, semiconductor materials, and many plastics.


  • For bonding, sealing, and coating
  • NASA low outgassing
  • Long open time at room temperature
  • Cures rapidly at 250 to 300°F (125 to 150°C)
  • Single component system, no mixing needed
  • Not premixed and frozen, unlimited working life
  • Ideal viscosity for die attach and general bonding
  • Electrical and thermal conductivity
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