High-Strength Epoxy Ideal for Underfill Applications


EP3UF is a one-part epoxy that contains ultra fine thermally conductive particles.


It features a high mechanical strength, dimensional stability, and a low thermal resistance of 5-7 x 10-6 K•m2/w.


This low-viscosity system has good flow properties and can be applied in bond lines as thin as 10-15 microns. It offers a thermal conductivity of 9-10 Btu•in./ft2•hr•°F [1.30-1.44 w/(m•K)] and a volume resistivity exceeding 1,014 ohm-cm. EP3UF also passes NASA low outgassing tests.



  • high mechanical strength
  • contains ultra-fine thermally conductive particles
  • thermal resistance of 5-7 x 10–6 K-m2/w
  • applies in bond lines as thin as 10-15 microns
  • thermal conductivity of 9-10 Btu-in./ft2-hr-°F
  • volume resistivity exceeding 1014 ohm-cm
  • pass NASA low outgassing tests
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