Low Density Epoxy
Description
Low Density Epoxy…The weight of 20-3035 is less than half of most commercially available potting and encapsulating compounds. This epoxy syntactic foam system utilizes technologically advanced micro balloons. This provides for a low density, low coefficient of thermal expansions, low shrinkage, and a stiff finished product.
This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. The option of selecting from three different curing agents allows end users to customize the physical properties they require.
Key Features:
• Low Density
• Excellent electrical insulation
• Low shrinkage
• Low CTE (coefficient of thermal expansion)
• Excellent water resistance
Samples are available.
This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. The option of selecting from three different curing agents allows end users to customize the physical properties they require.
Key Features:
• Low Density
• Excellent electrical insulation
• Low shrinkage
• Low CTE (coefficient of thermal expansion)
• Excellent water resistance
Samples are available.
Specs
- epoxy syntactic foam system
- low density, low coefficient of thermal expansions
- low shrinkage