Low Expansion, 500°F, Room Temperature Curing Epoxy
Description
Cotronics Corp. has introduced Duralco™ 4463, a Low Expansion, 500°F, Room Temperature Curing Epoxy. Duralco™ 4463 resists electricity, chemicals and moisture and has excellent dimensional stability. It is a user friendly, 100% solid system that you just Mix, Apply and Cure at room temperature. This epoxy features no volatiles, low odor and No VOC's.
Duralco™ 4463 has superior adhesion to most glass, ceramics, metals and plastics and is ideal for high performance bonding and encapsulating applications.
Duralco™ 4463 has superior adhesion to most glass, ceramics, metals and plastics and is ideal for high performance bonding and encapsulating applications.