Master Bond Polymer System EP21 is a two component, room temperature curing epoxy adhesive featuring outstanding physical properties and a very forgiving 1 to 1 mix ratio by weight or volume. In fact, EP21 has the unusual characteristic of being able to adjust the properties of the cured system by altering the mix ratio. Adding more A part (e.g. 2:1 mix ratio) gives a more rigid cure while adding more B part (e.g. 1:2 mix ratio) gives a more forgiving cure. The EP21 produces high strength, durable bonds which hold up well to thermal cycling and resists many chemicals including water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -60°F to +250°F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubber, and many plastics. Once cured, EP21 is an excellent electrical insulator. This exceptionally versatile system is widely used in the electronic, electrical, computer, metalworking, appliance, automotive, chemical and OEM industries. 


 - Convenient mixing: non critical 1:1 mix ratio by weight or volume.
 - Variable mix ratio feature allows adjusting the type of cure. Adding more A part (e.g. 2:1) gives a
more rigid cure (enhanced machinability) while adding more B part (e.g. 1:2) gives a more forgiving
cure (greater impact resistance).
 - Easily applied; adhesive spreads evenly and smoothly.
 - Ambient temperature cures or fast elevated temperature cures as required.
 - High bonding strength to a wide variety of substrates.
 - Excellent dimensional stability.
 - Good electrical insulation properties.
 - Superior durability, thermal shock and chemical resistance

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