EP21ANHT Two-Component Epoxy
Description
Master Bond Polymer Adhesive EP21ANHT is a two component room temperature curing adhesive, sealant and coating that has an exceptionally high thermal conductivity of over 22 BTU•in/ft2 •hr•°F. EP21ANHT is recommended for high temperature applications where service temperatures may reach 400°F. It has an exceptionally forgiving 1:1 mix ratio by weight or volume. Although room temperature curable, accelerated cures are possible by adding heat. As a thermally conductive adhesive it will adhere to a wide variety of substrates and can offer a tensile shear strength over 1800 psi. Other noteworthy features included superior electrical insulation properties and enhanced dimensional stability. EP21ANHT offers superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +400°F.
Specs
- Room temperature curing
- One to one mix ratio by weight or volume
- High temperature resistant up to +400°F
- Excellent heat transfer properties
- Outstanding electrical insulation
- High bond strength