EP30 Highly Versatile, Two-Part Epoxy System

Description

Master Bond Polymer System EP30 is a low viscosity, two-component epoxy adhesive for general purpose bonding, coating, sealing, and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and bonded assemblies must exhibit superior dimensional stability. Linear shrinkage after cure is an exceptionally low 0.0003 inches/in. An even lower viscosity version called EP30LV is also available. 

Specs

  • Superb optical clarity
  • Low shrinkage upon curing
  • Very low viscosity
  • Withstands 1,000 hours 85°C/85% RH
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