Pressure Soldering System

Description

 

Palomar Technologies, a global leader in total process solutions for advanced photonics and microelectronic device packaging, announced that SST Vacuum Reflow Systems, a wholly owned subsidiary of Palomar Technologies, has launched the SST 8300 Series Automated Vacuum Pressure Soldering System. The series, consisting of single and triple chamber systems provides a highly reliable solder connection with a better than industry standard void rate – a key to delivering high-reliability power modules for automotive and commercial applications.

 

The SST 8300 Series Automated Vacuum Pressure Soldering System differs from current systems on the market by utilizing SST's unique system of applying both vacuum and gas pressure to achieve an extremely low void ratio for the soldering interface of key components inside a power module, especially for DBC-to-baseplate soldering. The power module market is actively seeking a flux-free solder process that achieves low void rates, which provide for higher reliability and longer life. Other industry segments with a demand for highly reliable power modules include power converters for wind turbines, photovoltaic solar energy systems, and other renewable energy applications, as well as industrial motor controls and large scale medical devices. Specific applications include: IGBT/SiC/GaAs/GaN die attach, CPV solar cell assembly, die attach for pressure sensors, hermetic sealing of high-reliability packages, high intensity LED attach, hermetic sealing of IR image sensors, copper clip soldering, high power laser module assembly, and multilayer ceramic capacitors.

Specs

Other key benefits of the 8300 Series include:

  • Automated high-volume production vacuum pressure soldering system
  • Enables low-void solder connections with preforms or with solder paste
  • Offers maximum flexibility for processing a wide range of solder alloys and other alternative interconnect materials
  • Each chamber of the SST 8303 runs a complete process allowing multiple processes to be run in parallel
  • Flexible configuration for any production line: single (8301) or triple (8303) chamber
  • Oxide removal technology using formic acid or forming gas
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