Samtec’s extensive line of Rugged and Power interconnects is designed specifically to address the Board-to-Board, Cable-to-Board, and Panel & I/O needs of applications requiring high power or highly durable solutions. These products are particularly well suited to Industrial, Manufacturing, Processing, Measurement, Solar and LED applications, Military/Aerospace/Avionics and Automotive industries, and for Medical equipment & devices.
Several significant additions have recently been made to Samtec’s Rugged/Power product line.  A new space-saving IP68-rated sealed rectangular system features either Mini Mate® isolated power (RC1/RPB1 Series) or rugged Tiger Eye™ interfaces (RCT/RPBT Series).  Also available is a new high speed coax cable system (ERCD Series) and flex circuits (ERDL2 Series) with rugged Edge Rate™ connector strips or SEARAY™ High Density Arrays (SADL Series).  Other notable new rugged solutions include a 2mm (.0787”) pitch discrete wire assembly (S2SD/T2SD Series) with the popular high-reliability Tiger Eye™ multi-finger BeCu contact system and the addition of a high temp cabling option for several of Samtec’s discrete wire systems (PTFE Series).
New power application solutions include an expansion of the PowerStrip™ interface family with 10A (UPPT Series) and 25A (MPPT Series) hermaphroditic pass-through systems as well as the new high speed Q Rate™ interface with a space-saving slim body design and integral power/ground plane (QRM8/QRF8 Series). A reverse gender IP68-rated sealed circular power system, ideal for solar applications, is also now available.


• Insulator Material: Black LCP • Contact Material: BeCu • Ground Plane Material: Phosphor Bronze • Plating: Au or Sn over 50µ" (1,27µm) Ni • Current Rating: 2.0A @ 80°C ambient • Operating Temp Range: -55°C to + 125°C • Voltage Rating: 215 VAC • RoHS Compliant: Yes • Max Processing Temp: 230°C for 60 seconds, or 260°C for 20 seconds 3x • Lead–Free Solderable: Yes • SMT Lead Coplanarity: (0,10mm) .004" max (026), (0,15mm) .006" max (052-078)
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