W. L. Gore & Associates (Gore) is pleased to introduce a new capability to the GORE™ POLARCHIP® Thermal Interface Material family. GORE™ POLARCHIP® SF3000 Silicone-Free Thermal Interface Material is a truly soft silicone-free thermal gap pad. The absence of silicone eliminates the problems of silicone outgassing and silicone oil migration (“bleeding”), making GORE™ POLARCHIP® SF3000 Silicone-Free Thermal Interface Material the ideal gap pad for silicone sensitive applications. This highly compressible, thermally conductive material is ideally suited for filling the undesirable air gaps between heat generating devices on printed circuit boards (PCBs) and the heat sinks, heat spreaders and metal chassis that are used to dissipate the heat. GORE™ POLARCHIP® Thermal Interface Material is a fluoropolymer composite that consists of an expanded polytetrafluoroethylene (ePTFE) matrix filled with boron nitride (BN) particles. The low elastic modulus of the ePTFE matrix imparts softness, conformability and excellent compressibility to the composite, while the high thermal conductivity of the BN particles gives the composite its good thermal transport characteristics. The reinforcing nature of the ePTFE matrix results in a composite that is physically robust, easy to handle and does not require additional reinforcement. GORE™ POLARCHIP® Thermal Interface Materials are produced in continuous rolls with a pressure sensitive adhesive on one side. It can be supplied in sheets or rolls of precision die-cut parts suitable for high volume automation assembly.
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