Transceiver Optimizes Operation

Description

Compact 150G full-duplex (12+12) 12.5Gbps/lane optical fiber transceivers for harsh environment applications in Aerospace and Defense, LightABLE LL 150G full-duplex devices, are designed to be embedded on printed-circuit boards in close proximity to high-speed electronics in high performance embedded computing systems to optimize their operation.

 

The same transceivers can also be integrated with blind mate interconnects (LightCONEX), as per VITA 66.5, to free up more space on the board and reduce optical fiber management. 

 

These devices have been designed to maximize SWaP. They are very compact, weigh less than 5 g, and have power consumption as low as 120 mW/lane. In addition, thermal management is optimized through multiple heat dissipation paths in the compact volume of these transceivers.

 

The LightABLE LL modules attach with an LGA socket; a technology that offers high-speed and high-performance electrical interface, height flexibility, screw-in mechanical reliability, and practical insertion/removal capabilities.

 

The LightCONEX LC 150G full-duplex active blind-mate optical interconnect, based on the OpenVPX standards, frees up board space by integrating the optical transceiver into the board edge connector. The backplane connector, also part of the LightCONEX solution, has a spring-loaded mechanism ensuring optimal optical mating meeting VITA 66.0 requirements. The rugged construction of these connectors ensures error-free data transmission under severe shock, vibration, and temperature extremes.

 

The LightABLE LL and LightCONEX LC find applications in optical backplanes and VPX systems, like those deployed in high-performance embedded computing systems for civilian and military command and control monitoring (C4ISR) systems.

 

A technical paper presenting this transceiver more in-depth and entitled High-Density 12 Transmitters Plus 12 Receivers Rugged Optical Fiber Transceivers will be presented at the Avionics and Vehicle Fiber-Optics and Photonics Conference 2018 (AVFOP) on November 14.

Specs

Features:

  • Small: Less than 6 mm high (module and interposer)
  • Rugged: MIL-STD 883 shock and vibration qualified
  • Sealed: Moisture and thermal shock resistant
  • Storage temperature: –57 to 125ºC
  • Performance: 12.5 Gbps/lane from –40 to 100ºC
  • BER: As low as 10–15
  • Sensitivity: –12 and –9 dBm versions available
  • Proven: Thousands used in aerospace and defense applications
  • Low power consumption: 100 mW/lane
  • Multimode 850 nm wavelength laser
  • Over 100 m reach on OM3 ribbon fiber
  • Standard MT parallel fiber connector
  • RoHS
  • Equalizer, pre-emphasis, adjustable output
  • Monitoring: LOS, RSSI, temperature etc.
  • Integrated microcontroller
  • Available in industrial (–40 to 100ºC) grade temperature range
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