Pulsed Heat Reflow Soldering System for Repeatable Bond Planarity

Description

Using the Uniflow 4 pulse heated reflow soldering power supply, the newhorizon hot-bar reflow soldering systems provide integrated heat process control to maximizes production output and is the perfect choice for flex to ceramic, component to printed circuit board (PCB), flex to PCB, wire to PCB, and leadframe to PCB.

The configuration includes pneumatic bonding heads and two-dimensional or three-dimensional thermodes, X-Y thermode planarity adjustment, electronic temperature and system control, and digital bond force readout. The unit features active integrated cooling for heavy duty cycle operation. Process parameters are embedded into the system, ensuring consistent process quality and operator independence.

Specs

  • Mounted on a simple adjustable frame construction
  • Configuration includes: pneumatic bonding heads and two-dimensional or three-dimensional thermodes, X-Y thermode planarity adjustment, electronic temperature and system control, and digital bond force readout
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