Master Bond EP21TDCSFL is a two-component, room temperature curing, silver filled, epoxy adhesive and has an elongation of >60%. EP21TDCSFL is easy to use...
Master Bond EP3RRLV is a one-component, tough epoxy system designed for potting, encapsulation, and underfill applications. EP3RRLV will cure in 30-35...
A nickel-filled, flexible, two-component epoxy adhesive called EP21TDCNFL is prepared for use by mixing the two components with a user-friendly, non...
A single-component, high-performance epoxy adhesive called EP13 requires no mixing and has an unlimited working life at room temperature. EP13 has excellent...